COURSE TITLE
Rapid Curing Techniques For Polymer Adhesives, Coatings and Encapsulants
DATE
10 September 1999
COURSE SPEAKERS
Professor Marc J M Abadie
Montpellier University II
France
&
Associate Professor Freddy Y C Boey
Nanyang Technological University
Singapore
COURSE CONTENT
Thermosetting polymers are extensively used as sealant, coatings, encapsulation material, adhesives etc in the aerospace, electronics/microelectronics, printing and related industries. The objective of this one-day course was to introduce the basic principles of polymer curing together with the recipe for obtaining optimal properties during curing. Discussions by the speakers included the principles and practice of emerging radiation curing processes, such as UV curing, electron beam curing and microwave curing, which are the potential rapid curing techniques capable of meeting the challenges of the new millennium.
PARTICIPANTS
The course attracted a total of 44 participants from various organisations and industries as summarised below:
Ngee Ann Polytechnic: 5
Litton Components Pte Ltd: 2
Epoxy and Equipment Technology Pte Ltd: 1
BP Amoco Chemical: 1
Sumitomo Bakelite Singapore Pte Ltd: 1
Philips Singapore Pte Ltd: 1
Biosensors International Pte Ltd: 1
Rohm and Haas Singapore Pte Ltd: 2
Hewlett-Packard Singapore Pte Ltd: 2
Singapore Productivity and Standards Board: 5
ASM Technology Singapore Pte Ltd: 2
Rhodia Singapore Pte Ltd: 1
Becton Dickinson Critical Care Systems Pte Ltd: 5
Miracon Singapore Pte Ltd: 1
Institute of Materials Research and Engineering: 4
Matsushita Refrigeration Industries (S) Pte Ltd: 1
Perkin Elmer Asia: 1
Singapore Polytechnic: 1
Advanced Micro Devices (S) Pte Ltd: 2
Pepperl + Fuchs (Mfg) Pte Ltd: 3
Lands & Estates Organisation, Ministry of Defence, Republic of Singapore: 2